LogicTouch SV TCL & Associates Probe Company China Japan Europe

The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL’s LogicTouch is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).

  • Fine Pitch Capability Down to 50µm
  • No Chip Design Limitations
    Probe Arrays
    Corner Pads
  • Single Pin Repairable
  • MEMS-Style Probes
    Greater Scrub Consistency
    More Dimensional Control

Contact your SV TCL & Associates Probe Company China Japan Europe Representative so we can help you find the right LogicTouch product for your vertical testing needs.